CMC

Product ID:

Copper molybdenum copper (CMC) packaging material is a sandwich structure of flat composite material, it USES pure molybdenum as the core material, double coated with pure copper or dispersion reinforced copper.
 
This material has adjustable thermal expansion coefficient, high thermal conductivity and excellent high temperature resistance. The production process is generally made by rolling compound, electroplating compound and explosive forming. Mainly used for heat sink, lead frame and multilayer printed circuit board (PCB) bottom expansion and thermal conductivity channel.
 
G over cm cubed
 
W/mK 
 
10-6 / K
 
 Type material
 
material density
(g/cm³)
Coefficient of thermal conductivity
W/mK
Coefficient of thermal expansion
10-6/K
CopperMetallaminate 1:1:1
Cu/Mo/Cu
9.32 305(xy)/250(z) 8.8
1:2:1
Cu/Mo/Cu
9.54 260(xy)/210(z) 7.8
1:3:1
Cu/Mo/Cu
9.66 244(xy)/190(z) 6.8
1:4:1
Cu/Mo/Cu
9.75 220(xy)/180(z) 6
13:74:13
Cu/Mo/Cu
9.88 200(xy)/170(z) 5.6

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