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Similar to those of Cu/mo/Cu (CMC), molybdenum copper/copper/copper is also a sandwich structure, it is made up of two deputy layer - copper (Cu) around a core layer - molybdenum copper alloy (MoCu), it is in the region of the X and Y area have different thermal expansion coefficient, compared with molybdenum tungsten copper, molybdenum, copper and copper / / copper materials, copper molybdenum copper copper (Cu/MoCu/Cu) thermal conductivity is higher, the price also have relative advantage.
Advantages of copper/molybdenum copper/copper (CPC) electronic packaging materials:
1. Higher thermal conductivity than CMC
2. Can be processed into parts to reduce costs
3. The interface bonding is firm, can be repeated under 850 ℃ high temperature shock
4. Designed thermal expansion coefficient, matching with semiconductor and ceramic materials
5. Nonmagnetic
Brand     density  g/cm3 thermal expansion coefficient ×10-6
heat conduction coefficientW/(M·K)
CPC141 9.5 7.3 211
CPC111 9.2 9.5 260
CPC232 9.3 7.5 250
With designable thermal expansion coefficient and thermal conductivity, copper/molybdenum copper/copper (CPC) is used as the substrate and flange for rf, microwave and semiconductor power devices.
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