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Tungsten-copper electronic packaging materials not only have the low expansion characteristics of tungsten, but also have the high thermal conductivity of copper, especially valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material, thus bringing great convenience to the application of the material.
Our company adopts high purity and high quality raw materials, after pressing forming, high temperature sintering and melting infiltration, WCu electronic packaging materials and heat sink materials with excellent performance are obtained.
Tungsten copper (WCu) electronic packaging material advantages:
1. Tungston-copper electronic packaging materials have adjustable thermal expansion coefficient, which can be matched with different substrates (e.g., stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);
2. No sintering activated elements are added to maintain good thermal conductivity;
3. Low porosity, good air tightness;
4. Good size control, surface smoothness and flatness.
5. Provide sheet materials, shaped parts, and can also meet the needs of electroplating.

Brand   tungsten content
density  g/cm3 hermal expansion coefficient×10-6  CTE(20℃) heat conduction coefficient W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃)/ 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)
Suitable for packaging materials with high-power devices, such as substrate, lower electrode, etc. High performance lead frame; The heat control panel and radiator of military and civil heat control device.
Key words: tungsten copper heat sink package, tungsten copper bar, tungsten copper fin
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