Tungsten Silicon Sputtering Target
UMM specializes in producing high purity Tungsten Silicon Sputtering Targets with the highest possible density High Purity (99.99%) Metallic Sputtering Targetand smallest possible average grain sizes for use in semiconductor, chemical vapor deposition...
Molybdenum niobium target
Product Name Chemical Symbol Purity Main Alloy Component Specification molybdenum niobium target Mo-Nb 2N5 MoNb(90:10wt%0.5%) Plate Shape Rectangle Shape Step Shape Can be customized per different request...
Aluminum Silicon Sputtering Target
Product Name Chemical Symbol Purity Main Alloy Component Specification AluminumSilicontarget Al-Si 3N SiAl(90:10wt%1%) Plate Shape Rectangle Shape Step Shape Can be customized per different request...
Nickel Chromium Sputtering Target
Product Name Chemical Symbol Purity Main Alloy Component Specification Nickel Chromium target Ni-Cr 3N NiCr (60:40wt%/80:20wt%) Plate Shape Rectangle Shape Step Shape Can be customized per different request...
Cu-In-Ga-Se Lump target
Product Name Chemical Symbol Purity Main Alloy Component Specification Copper indium gallium selenide target Cu-In-Ga-Se 3N-5N Cu:In:Ga:Se=1:1:1:4at% Plate Shape Rectangle Shape Step Shape Can be customized per different request...
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